xMEMS Memories was in the news for debuting its innovative chip cooling technology in August, 2024. This latest innovation follows a successful run by the company’s earlier solid-state microspeakers created with earbuds in mind. This multipronged chip cooling technology will soon address some of the biggest thermal management challenges. That’s going to improve the power performance of everything from smartphones to hyperscale data centers.
At the heart of xMEMS’ cooling tech is piezoelectric materials that can morph at ultrasound frequencies. This special pumping action is what enables the novel cooling chip to pump an astounding 39 cubic centimeters of air per second. As a result, it brings an impactful solution for heat dissipation in small electronic devices. The stackable chip is just a millimeter tall and less than a centimeter on a side. Its small footprint allows for integration on smaller devices like smartphones, which typically lack the physical space for fan-based, conventional cooling methods.
Up next, xMEMS expects to have its chip cooling technology in high-volume production by Q1 of 2026. This timeline suggests that the company is preparing to meet the growing demand for efficient cooling solutions in both consumer electronics and data centers. Proactive production As our dependence on data-driven technologies grows deeper, the thermal stakes get higher and higher – making effective thermal management more vital.
xMEMS’ chip cooling technology has major implications for data centers. These massive facilities are increasingly used to power energy-hungry artificial intelligence (AI) systems. These systems frequently rely on optical transceivers—complex components comprising digital signal processors (DSP), photonics integrated circuits (IC), and lasers—that can consume up to 40 megawatts of power in a data center housing 400,000 GPUs. Each transceiver goes for more than $2,000. Through proper, efficient cooling, we can prolong the life expectancy of materials in addition to saving on costs.
As promising as xMEMS’ innovative chip cooling technology is, it stops well short of leveling the field with superior liquid cooling systems. These systems have the potential to absorb several thousand watts of heat from GPU servers. Traditional liquid cooling methods remain the standard for high-performance computing environments due to their efficacy in managing substantial heat loads.
The possible applications for xMEMS’ chip cooling technology are extensive. The company has zeroed in on about 20 to 30 simple applications that it believes would be well served by its novel design. The need for high-speed data transmission continues to grow exponentially. Shipments of optical transceivers rated 800 gigabits per second and 1.6 terabits per second are on track to increase spectacularly, more than doubling each year for over 35 percent year-on-year growth through 2028.
In discussing the response from data center customers, Mike Housholder remarked, “We were pleasantly surprised by the approach by data center customers.” This enthusiastic response is a testament to the incredible potential of xMEMS’ technology. By tackling particular thermal management challenges, it might even create a stronghold within the larger industry.
Our own Thomas Tarter, another xMEMS rep, discussed the learning curve when working with such new technology. He stated, “We’re learning a lot about applications,” indicating that the company is actively exploring diverse use cases for its product. He further elaborated on the potential impact of their innovation by saying, “Oh, this is how I can use this in my system.”
Firms such as Broadcom are carrying new breakthroughs in digital signal processing. Collectively, these innovations have the potential to save more than 20 percent in power consumption per 1.6 Tbps transceivers, leading the development of the market toward more efficient cooling solutions. By improving chip cooling technology xMEMS has the potential to revolutionize the industry. It has proven innovative thermal management solutions that deliver on the new promise and perils of emerging technologies.