EP112, a new ultra-low-viscosity, electrically insulating epoxy, is on her way to revolutionizing the microelectronics industry. Master Bond’s two-part, heat cure epoxy system has superior optical clarity and chemical resistance characteristics, making it ideal for applications where these properties are critical. Now, researchers at Lawrence Livermore National Laboratory (LLNL) have capitalized on the unusual properties of EP112. They deploy it to temporarily bond substrates in their cutting-edge START (Silicon Transfer to Arbitrary Substrate) process. Early on, this iterative process molded the path for the creation of a prototype liquid crystal display (LCD).
Key Role in Advanced Semiconductor Applications
EP112 has been found to be essential in the field of semiconductors, particularly for use in the wafer-thinning process. This fundamental recycling process is needed to improve reliability by rebuilding and recycling CMOS-based next-generation integrated circuits (ICs). By providing durability and structural integrity even in the most severe conditions, EP112 allows the thinning process to be completed successfully. This ability is especially advantageous in re-configuring regular bulk silicon wafers with finished circuits into SOI-like (Silicon-on-Insulator) structures.
Additionally, the epoxy’s chemical resistance to alkali solutions commonly used in the silicon processing de-bonds during high temperature alkaline etching stages. This resistance is important to maintaining the structural integrity of the underlying bonded substrates. This ensures the successful execution of demanding microelectronics fabrication processes.
Contribution to Cost-Effective Fabrication
Cost efficiency
Another major benefit of using EP112 in microelectronics fabrication is that it’s cost efficient. The epoxy system takes the benefits of bulk silicon electronics coupled with SOI technology. This combination ends up being a more cost effective way to deploy complex production methods. EP112 can modulate otherwise standard silicon wafers into SOI-like structures. By licensing development of advanced chips to low-cost foundries, this innovation dramatically reduces the total costs of semiconductor development.
Additionally, EP112’s use and process within the START process at LLNL highlights its crucial function in new fabrication technologies. The epoxy’s enhanced characteristics increase reliability while still keeping the production of high-performance microelectronic devices economical.
Pioneering Developments in LCD and IC Production
EP112’s unique properties, which helped prototype LCDs become a reality, underscore its critical importance in advanced electronics today. The impressive bonding of substrates provided with this high-performance epoxy was the key to producing a tough, long-lasting, and dependable LCD assembly. This breakthrough proves EP112’s value across other emerging electronic applications, clearing the path for continued advancements.
The epoxy’s critical role in CMOS-based ICs’ reliability only underscores epoxy’s importance to microelectronics. As an important part in these innovative manufacturing processes, EP112 contributes to the continuous advancement and improvement of electronic devices.