NLM Photonics and Imec have made tremendous progress in photonics. Photonics’ innovative devices are poised to revolutionize data transmission rate standards across telecommunications. Both made powerful statements showcasing their most recent technology advances at the European Conference on Optical Communication in Copenhagen, Denmark, in mid September. NLM Photonics’ electro-absorption modulator and Imec’s chip featuring eight Mach-Zehnder modulators represent a milestone in the quest for faster, more efficient data transfer.
The uniqueness of NLM Photonics’ device is that it can work at 300 mm without any manufacturing defects. This remarkable success heralds a new era for all silicon-based technologies. It reaches a staggering 448 gigabits per second (Gb/s) per lane. This performance is well beyond the nominal 100 Gb/s per lane available from most higher volume transceivers on the market today. This development is the first big step in the new technology. Companies are now actively targeting speeds of 200 Gb/s per lane in an effort to keep up with our industry’s insatiable demand.
In comparison, Imec’s chip—only about 300 square microns total—uses eight Mach-Zehnder modulators. Each modulator makes precise real-time adjustments to the magnitude and phase of scattered light to produce complex optical effects. Most significantly, Imec’s architecture allows for electrical modification of one of these paths, altering the phase of the signal to improve the potential for data transmission.
Breakthroughs in Data Rates
NLM Photonics and Imec have joined forces to achieve excellent outcomes. They’ve succeeded in the feat by pushing electrical data rates to new heights, including stunning 400 Gb/s per lane! This performance, the best of any silicon-based material used to date in this speed category, proves silicon-based materials’ promise in high-speed applications. The development is being closely watched by the industry as it attempts to build on the promise of existing technologies to pursue their full potential.
NLM Photonics’ device works best in the conventional (C) telecommunications band, using infrared rays of about 1550 nanometers wavelength. This wavelength is especially important for long-distance communication, thus NLM’s advancements are especially applicable and needed within today’s telecommunication infrastructures.
“It’s a device available now at 300 mm, without any question of manufacturing issues.” – Clint Schow
Schow described this achievement as groundbreaking, indicating that it has the potential to raise the bar for the industry. Simplifying the ability to manufacture devices at this scale without thermal runaway highlights NLM Photonics’ commitment to innovation and reliability.
Long-term Stability and Reliability
Aside from its record data rates, NLM Photonics’ device has shown long-term thermal stability above 120 degrees Celsius. This durability is especially critical for telecom hardware, which are frequently deployed in harsh conditions. The firm’s encapsulation technology shines when pushed to the extreme. It resists continuous exposure to temperatures up to 85 degrees Celsius and passes extreme hot and humid temperature cycling tests.
These attributes make NLM Photonics’ device an attractive and proven solution for telecommunications operators seeking to upgrade their networks and stay competitive. The company was committed to making sure that its products exceeded the strict standards established by the industry, but still managed to innovate.
“Our near-term focus is working toward manufacturability at scale.” – Johnson
Johnson emphasized the company’s goal to deliberately scale up production and do it at such a rate that quality isn’t sacrificed. This focus on making designs manufacturable dovetails with the increasing appetite for ever more nuanced, high-performing telecommunication devices.
The Future of Photonics
NLM Photonics and Imec are doing exciting work to advance photonics technology. Experts are excited about the promising future of data transmission. With each passing day, the race between different technologies intensifies as developers search for better nonwoven or next-generation materials that could provide even more performance.
“Any of these technologies could end up winning.” – Clint Schow
Schow’s hopeful observation speaks to an industry zeitgeist in which no single innovation has yet emerged as the clear winner. As we continue to explore new materials beyond silicon like polymers, we may be on the cusp of revolutionary breakthroughs that will change the face of telecommunications.
“Silicon still has plenty of headroom, even for the most demanding high-speed applications.” – Bruynsteen
While alternative materials have increased in market presence, Bruynsteen acknowledged that silicon-based solutions are still strong and advancing toward more future applications. By incorporating these new innovations into current infrastructures, organizations can continue to stay ahead of the curve in the fast-paced world of innovation.